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REVIEW OF PROGRES IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 26

Review of Progress in Quantitative Nondestructive Evaluation Volume 26

Donald O. Thompson, Iowa State University, Aerospace Engineering, Ames, IA, USA ; Dale E. Chimenti, Iowa State University, Aerospace Engineering, Ames, IA, USA


AIP Conference Proceedings 894


Conference Location and Date: Portland, Oregon, 30 July - 4 August 2006


Subseries: Materials Physics and Applications

Published March 2007; ISBN 978-0-7354-0399-4 Two Volume Print, CD-ROM included; 2016 pages; 7x10 inches; Hardcover; $376.00

Readership: Academic research faculty and students; industrial NDE engineers and designers; governmental researchers and program planners.

These Proceedings provide the latest research and development papers in nondestructive evaluation (NDE) and its applications to flaw detection, material properties, and structural reliability. The papers are prepared by a line-up of internationally known researchers and are reviewed by qualified scientists. Papers cover recent developments in essentially all measuring techniques (ultrasonics, electromagnetic, X-rays, thermal, acoustic emissions, etc.) and their applications to flaw detection and structural reliability.

Related AIP Titles:

CP# Editor(s) Title
955Elert, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2007: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
949Benediktsson, et al.6TH INTERNATIONAL WORKSHOP ON INFORMATION OPTICS (WIO'07):
945Ogawa, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Ninth International Workshop on Stress-Induced Phenomena in Metallization
931Seiler, et al.CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2007 International Conference on Frontiers of Characterization and Metrology
929Salamin, et al.NANOTECHNOLOGY AND ITS APPLICATIONS: First Sharjah International Conference on Nanotechnology and Its Applications
914Cai, et al.MULTIPHASE FLOW: THE ULTIMATE MEASUREMENT CHALLENGE: Proceedings of the 5th International Symposium on Measurement Techniques for Multiphase Flows and 2nd International Workshop on Process Tomography
911Coussios / ter Haar6TH INTERNATIONAL SYMPOSIUM ON THERAPEUTIC ULTRASOUND:
909Senin / IdrisSOLID STATE SCIENCE AND TECHNOLOGY: 2nd International Conference on Solid State Science and Technology (ICSSST 2006)
908Cesar de Sa / SantosMATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications; NUMIFORM 2007 Proceedings of the 9th International Conference on Numerical Methods in Industrial Forming Processes
907Cueto / Chinesta10TH ESAFORM CONFERENCE ON MATERIAL FORMING:
893Jantsch / SchafflerPHYSICS OF SEMICONDUCTORS: 28th International Conference on the Physics of Semiconductors
860Cristóbal, et al.INFORMATION OPTICS: 5th International Workshop on Information Optics; WIO'06
859FritzscheDNA-BASED NANOSCALE INTEGRATION: International Symposium on DNA-Based Nanoscale Integration
845Furnish, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2005: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
838Atchley, et al.INNOVATIONS IN NONLINEAR ACOUSTICS: ISNA 17; 17th International Symposium on Nonlinear Acoustics including the International Sonic Boom Forum
837Myneni / HjörvarssonHYDROGEN IN MATTER: A Collection from the Papers Presented at the 2nd International Symposium on Hydrogen in Matter; ISOHIM
834Nilsson / FishmanMATHEMATICAL MODELING OF WAVE PHENOMENA: 2nd Conference on Mathematical Modeling of Wave Phenomena
829Clement, et al.THERAPEUTIC ULTRASOUND: 5th International Symposium on Therapeutic Ultrasound
824BalachandranADVANCES IN CRYOGENIC ENGINEERING: Transactions of the International Cryogenic Materials Conference - ICMC, Volume 52
820Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 25
817Zschech, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: 8th International Workshop on Stress-Induced Phenomena in Metallization
788Seiler, et al.CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2005:
786Kuzmany, et al.ELECTRONIC PROPERTIES OF NOVEL NANOSTRUCTURES: XIX International Winterschool/Euroconference on Electronic Properties of Novel Materials
778Smith, et al.NUMERICAL SIMULATION OF 3D SHEET METAL FORMING PROCESSES: 6th International Conference and Workshop on Numerical Simulation of 3D Sheet Metal Forming Processes; NUMISHEET 2005
772Menéndez / Van de WallePHYSICS OF SEMICONDUCTORS: 27th International Conference on the Physics of Semiconductors
765Gracia, et al.INDUSTRIAL APPLICATIONS OF THE MÖSSBAUER EFFECT: International Conference on the Industrial Applications of the Mössbauer Effect
760Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 24
741Ho, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization
725FritzscheDNA-BASED MOLECULAR ELECTRONICS: International Symposium on DNA-Based Molecular Electronics
723Kuzmany, et al.ELECTRONIC PROPERTIES OF SYNTHETIC NANOSTRUCTURES: XVIII International Winterschool/Euroconference on Electronic Properties of Novel Materials
712Ghosh, et al.MATERIALS PROCESSING AND DESIGN: Modeling, Simulation and Applications; NUMIFORM 2004 Proceedings of the 8th International Conference on Numerical Methods in Industrial Forming Processes
711BalachandranADVANCES IN CRYOGENIC ENGINEERING: Transactions of the International Cryogenic Materials Conference - ICMC, Vol. 50
706Furnish, et al.SHOCK COMPRESSION OF CONDENSED MATTER - 2003: Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
700Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 23
683Seiler, et al.CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY: 2003 International Conference on Characterization and Metrology for ULSI Technology
657Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 22
615Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 21
557Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 20
509Thompson / ChimentiREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION: Volume 19
497GreenNONDESTRUCTIVE CHARACTERIZATION OF MATERIALS IX: