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STRESS-INDUCED PHENOMENA IN METALLIZATION: Second International Workshop

Stress-Induced Phenomena in Metallization

Paul S. Ho, The University of Texas at Austin, Interconnect and Packaging Group, Austin, TX, USA ; Paul Totta, IBM Microelectronics Division, USA ; Che-Yu Li, Cornell University, USA


AIP Conference Proceedings 305


Conference Location and Date: Austin, TX, 29-31 March 1993

Published ; ISBN 1-56396-251-9 One Volume, Print; pages;

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Related AIP Titles:
CP# Editor(s) Title
945Ogawa, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Ninth International Workshop on Stress-Induced Phenomena in Metallization
817Zschech, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: 8th International Workshop on Stress-Induced Phenomena in Metallization
741Ho, et al.STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization
612Baker, et al.STRESS INDUCED PHENOMENA IN METALLIZATION: Sixth International Workshop On Stress Induced Phenomena In Metallization